ABOUT US

 

ALFACLEANER HISTORY

 

• Alfacleaner is a Brazilian Company that started in 1990.
• Our activities are in conformity with ISO 9001:2015
• All the products are formulated and produced by Alfacleaner.
• Alfacleaner is supported by an experienced technical team that has a long experience in the PCB fabrication.
• Alfacleaner plant has two buildings with 1,813.95 sq.m of constructed area localized in the city of Osasco, São Paulo, Brazil

 

WE REPRESENT AND DISTRIBUTE:

 

• Florida Cirtech (USA)

Selling Additives to Acid Copper

•  Shikoku Chemicals (Japan) 

OSP Glicoat SMD F2 (LX), Glicoat SMD-EX, and Microetching solution "Glibrite GB4300"

•  Dupont

 Distributing Dry film to small companies – Riston MM120i and Technical assistance in the Dry film area and P.O.P.

 

LOCALIZATION:

 

Our localization is near to the principal roads:

• Rodovia Castelo Branco
• Rodovia Anhanguera
• Rodovia dos Bandeirantes
• Rodoanel Mario Covas
• Rodovia Raposo Tavares
• Rodovia Regis Bittencourt
• Marginal Tietê
• Marginal do Rio Pinheiros

PRODUCTS

 

ALKALINE ETCHING

 

SUPERETCH-160

 

DESMEAR / ETCH BACK PROCESS:

 

SWELLER:

AMOLECEDOR EPX-2000 - 2 PARTS SWELLER

CLEANER EPX-801-TG - READY TO USE, FOR NORMAL TG 130º - 150º 

CLEANER EPX-801-HTG - USED FOR HIGH TG MATERIAL

 

CONDITIONER:

CONDICIONADOR EPX-802

 

REDUCER:

REDUTOR EPX-803

 

INNERLAYER PROCESS:

 

BLACK OXIDE

NEROX process

 

ALTERNATIVE OXIDE

BONDER process – 3 steps brow oxide

 

MICROETCHING SOLUTION - (SHIKOKU CHEMICALS)

GLIBRITE GB4300-R40:

Glibrite GB-4300 is an additive for copper roughening solution based on H2O2/H2SO4 system, which is designed for solder resist or inner-layer preparation, in order to give the best adhesion with lower etching amount

 

DRY FILM STRIPPER:

 

REMOVEDOR AQ-20 - LOW COST DRY FILM STRIPPER

REMOVEDOR AQ-50 - LOW COST DRY FILM STRIPPER FOR INNERLAYER PROCESS

REMOVEDOR AQ-100Sn - SPECIALLY DESIGNED FOR BOARDS WHERE THE TIN REMAINS IN THE BOARD

REMOVEDOR AQ-150 - DRY FILM STRIPPER FOR CONVENTIONAL DRY FILM (UV)

REMOVEDOR AQ-LDI - DRY FILM STRIPPER FOR L.D.I. / D.I. DRY FILM

REMOVEDOR AQ-LDI/17 - VERY FAST DRY FILM STRIPPER, SPECIALLY DEVELOPED FOR L.D.I. AND D.I. DRY FILM

REMOVEDOR RM-50 – VERY FAST SOLDERMASK STRIPPER WITH NO COPPER ATACK

 

METALLIZATION:

 

COBREFLASH CI-160 – LOW BUILD ELECTROLESS COPPER PROCESS, 15 - 20 MINUTES, 20 - 30ºC, 0,3 - 0,5 MICRON

 

COBRE RÁPIDO AV-161 - HIGH BUILD ELECTROLESS COPPER PROCESS, 20 - 30 MINUTES, 35 – 40ºC, 2,0 MICRONS COPPER DEPOSITION.

 

TIN AND TIN/LEAD STRIPPER:

 

2 STEPS PROCESS:

ENGESTRIP PRÉ-600 – FIRST STEP TIN STRIPPER

ENGESTRIP PÓS-600 – SECOND STEP TIN STRIPPER

 

SINGLE STEP PROCESS:

ALFASTRIP PLUS – NITRIC BASE TIN STRIPPER

 

HASL FLUX:

 

FLUXO HAL-2010 – WATER BASE FLUX

FLUXO HAL-7326 – WATER BASE FLUX FOR SMALL PADS BOARDS

FLUXO HAL-7509 – ALCOHOL BASE FLUX FOR DOUBLE SIDED BOARD

FLUXO HAL-7305 – ALCOHOL BASE FLUX WITH AN ADDITIVE TO SINGLE SIDED BOARD

REFLOW RE-700 – REFLOW OIL

 

ACID CLEANER:

 

CLEANER H-201 - LOW COST ACID CLEANER

CLEANER H-2000 - HIGH CONCENTRATION ACID CLEANER

CLEANER H-2007  - ACID CLEANER FOR SPRAY USE, WITH LOW FOAM FORMATION 

 

ALKALINE CLEANER:

 

DESENGRAXANTE ML-210  - USED IN THE ALTERNATIVE OXIDE, OSP, SURFACE PREPARATION (GLIBRITE PROCESS)

CONDICIONADOR ML-110 - USED IN THE ELECTROLESS COPPER LINE

CLEANER CI-740 - FOR USE AFTER HASL PROCESS

 

DEFOAMERS:

 

ANTIESPUMANTE RR-104 – WITHOUT SILICONE FOR DEVELOPER AND DRY FILM STRIPPER

ANTIESPUMANTE RRTE-105 – SILICONE BASE FOR WASTEWATER TREATMENT

 

ANTIOXIDANT AGENT

 

ANTIOXIDANTE CI-170

 

WASTEWATER TREATMENT

 

PRECIPITADOR TE-100 - METAL PRECIPITANT FOR CHELATED OR COMPLEXED HEAVY METALS

COAGULANTE TE-201 - INORGANIC COAGULANT

FLOCULANTE TE-300 - ANIONIC POLYMER

 

FINAL FINISH - (OSP - Organic Solderability Preservative) -  SHIKOKU CHEMICALS

 

GLICOAT SMD-EX

GLICOAT SMD F2(LX)

 

DRY FILM -  DUPONT

 

RISTON MM 120i - 50 MICRONS STANDARD DRY FILM FOR OUTERLAYER

RISTON EM-930 - 30 MICRONS DRY FILM FOR INNERLAYER

 

ELECTROLYTIC ACID COPPER - FLORIDA CIRTECH

 

ADITIVO CP-155 – SINGLE ADDITIVE TYPE FOR ELECTROLYTIC COPPER PLATING PROCESS

ADITIVO SP-130 – SINGLE ADDITIVE TYPE FOR ELECTROLYTIC TIN PLATING PROCESS

 

CONTACT:

 

 Rua Arinos, 321 - Pq. Ind. Água Vermelha 

 Osasco/SP   -    ZIP Code 06276-032  -  Brazil
 Tel: (+55) 11 3658-1200
 Cel: (+55) 11 97356-7459 (Claro)
 Email: frank@alfacleaner.com.br (Sales and Technical)
             irene@alfacleaner.com.br (Financial)
             alfacleaner@alfacleaner.com.br (Information)

     Or if you prefer, fill in the form on the side